英文名称缩写 |
英文名称 |
中文名称 |
SK-DIP |
Skinny DIP |
膜状DIP |
SL-DIP |
Slim DIP |
细长DIP |
SH-DIP |
Shrink DIP |
收缩DIP |
DIP |
Dual inline package |
双列直插式封装 |
ZIP |
Zigzag inline package |
直插式封装 |
SZIP |
Shrink ZIP |
缩小的ZIP |
PGA |
Pin grid array |
针栅阵列或柱形封装 |
HPGA |
PGA with heatsink |
散热的PGA |
SPGA |
Shrink PGA |
缩小的PGA |
QFJ |
Quad flat j-leaded package |
四边扁平封装,引脚为“J”形 |
QFP |
Quad flat package |
四边扁平封装 |
HQFP |
QFP with heatsink |
散热的QFP |
SQFP |
Shrink QFP |
缩小的QFP |
TPQFP |
QFP with test pad |
|
QTP |
Quad tape carrier package |
|
UTQFP |
Ultra thin QFP |
|
CQFP |
|
陶瓷四边扁平封装 |
PQFF |
|
塑料四边扁平封装 |
MQFF |
|
金属四边扁平封装 |
SOP |
Small outline package |
小外形封装,引脚为翼形“L”形 |
MSOP |
SOP with heatsink |
散热的SOP |
SOJ |
Small outline j-leaded package |
小外形封装,引脚为“J”型 |
SSOP |
Shrink SOP |
缩小的SOP |
TSOP |
Thin SOP |
|
DTP |
Dual tape carrier package |
|
SVP |
Surface wertical package |
|
UTSOP |
Ultra thin SOP |
非常瘦的SOP |
SON |
Small outline non-lead |
无铅的小外形封装 |
QFN |
Quad flat non-lead |
无铅的西边扁平封装 |
BGA |
Ball grid array |
球栅阵列封装 |
PGA |
Pin grid array package |
插针网格阵列封装 |
CSP |
Chip size package |
芯片尺寸封装 |
PICC |
|
有粗端引线 塑料芯片载体 |
USP |
Ultra small package |
非常小的封装 |
3DPM |
3 dimentional package module |
|
3D-SON |
3DPM-son |
|
3D-SVP |
3DPM-svp |
|
3D-DIP |
3DPM-dip |
|
MCM |
Multi chip model |
多芯片组件 |
声明:该文只适用于学习,其内容包含来自书本的摘抄和总结,欢迎大家补充,共同学习进步。