击穿特性是啥：MOSFET中的击穿是栅压过大导致氧化层击穿，而在hemt 中是在关断状态下，源漏电压逐渐增大，最终电流达到1mA/mm，此时的源漏电压是击穿电压
# (c) Silvaco Inc., 2015
go atlas
Title HEMT breakdown characteristics
#
# SECTION 1: Mesh input
#
mesh
x.mesh loc=0.0 spac=0.025
x.mesh loc=0.75 spac=0.025
y.mesh loc=-0.02 spac=0.01
y.mesh loc=0.0 spac=0.01
y.mesh loc=0.03 spac=0.001
y.mesh loc=0.0425 spac=0.01
y.mesh loc=0.055 spac=0.001
y.mesh loc=0.2 spac=0.05
# SECTION 2: Structure Specification
#
region num=1 material=GaAs y.min=0.03 y.max=0.055
region num=2 material=AlGaAs y.max=0.03 x.composition=0.3
region num=3 material=AlGaAs y.min=0.055 x.composition=0.3
region num=4 oxide y.min=-0.02 y.max=0
#
elec num=1 name=source x.min=0.0 x.max=0.0 y.min=0.0 y.max=0.05
elec num=2 name=gate x.min=0.1 x.max=0.6 y.min=0.0 y.max=0.0
elec num=3 name=drain x.min=0.75 x.max=0.75 y.min=0.0 y.max=0.05
#
doping uniform y.min=0 y.max=0.03 n.type conc=1.e18
doping uniform y.min=0.03 n.type conc=1.e15
doping uniform x.min=0.0 x.max=0.05 y.min=0.03 y.max=0.05 \
n.type conc=1.e18
doping uniform x.min=0.70 x.max=0.75 y.min=0.03 y.max=0.05 \
n.type conc=1.e18
#界面：qf面电荷密度
interface x.min=0 x.max=0.75 y.min=-0.01 y.max=0.005 qf=-1.e12
#
#
# SECTION 3: Material Models
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material taun0=1.e-9 taup0=1.e-9
material material=AlGaAs mun=2000 mup=350 nc300=5.7e17
material align=0.6
#
model fldmob srh
model material=GaAs conmob
#impect selb 这个是在例子3-69中得到的
impact selb an1=1.899e5 bn1=5.75e5 ap1=2.215e5 bp1=6.57e5 \
an2=1.899e5 bn2=5.75e5 ap2=2.215e5 bp2=6.57e5 egran=1.e20 betan=1.82 betap=1.75
#
contact name=gate workfun=4.73
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# SECTION 4: Bias gate
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method gummel newton itlim=20 trap maxtrap=6
output con.band val.band
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solve vgate=0
save outf=hemtex02_0.str
tonyplot hemtex02_0.str -set hemtex02_0.set
#
# SECTION 5: Drain ramp
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log outf=hemtex02.log master
solve vdrain=0.025 vstep=0.025 vfinal=0.4 name=drain
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method newton trap itlim=35 maxtrap=6
solve vdrain=0.50 vstep=0.25 name=drain vfinal=10 compl=1.e-3 e.comp=3
#
tonyplot hemtex02.log -set hemtex02.set
#
quit
